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Google will release 3rd Android 11 developer preview in May 2020

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Google will release 3rd Android 11 developer preview in May 2020. According to Google , the first beta version of Android 11 is due to be released in May 2020, and platform stability should be achieved in June. Google has released a new developer preview of Android 11. The third pre-release now brings some new features that could make it easier for programmers. The Exit Reasons API, for example, can be used to get details after an app suddenly quits. In the third preview version, Google updated the API based on user suggestions. The new ADB incremental mode should speed up the transfer of files via ADB (Android Debug Bridge). The installation of very large APK files via ADB can sometimes take a long time and thus reduce productivity.  Thanks to ADB Incremental, the transfer of files with more than 2 GB should be up to ten times faster. In the pre-release version, the new mode only works with the Pixel 4 and Pixel 4 XL, but after the start of Android 11, all new devices sho
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Huawei orders 14-nm smartphone chips in China (SMIC) instead of Taiwan (TSMC)

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Instead of TSMC , SMIC is to manufacture various smartphone chips for Huawei.



The Huawei subsidiary HiSilicon will have some upcoming systems-on-a-chips for smartphones produced directly in China instead of in Taiwan, reports the Digitimes industry service , citing sources in the supplier industry. Instead of the contract manufacturer TSMC, it should be directed by the local manufacturer SMIC.

TSMC (Taiwan Semiconductor Manufacturing Corporation) is by far the world's largest foundry, whereas SMIC (Semiconductor Manufacturing International Corporation) has so far only produced on a small scale and is also technically lagging a few years behind. It wasn't until the end of 2019 that SMIC announced that its own 14-nm finfet process had reached series maturity - other foundries such as Intel, Samsung and TSMC have been using this node since 2014.

HiSilicon now wants to use SMIC to produce various SoCs with this 14-nm process, i.e. primarily simpler and cheaper designs. The top models like the Kirin 990 (5G), on the other hand, are inevitable at TSMC, because HiSilicon designed the chip for the process called N7+, i.e. 7-nm EUV with extremely ultraviolet exposure. This type of production is currently only offered by Samsung in South Korea and TSMC in Taiwan, SMIC in China still uses classic immersion lithography (DUV).

The at least partial change from TSMC to SMIC was not entirely voluntary for HiSilicon: For months , US President Donald Trump has been trying to prevent Huawei from being supplied with chips from manufacturers outside the United States. All foundries worldwide use equipment from ASML from the Netherlands and from US companies such as Applied Materials, which is why the US government is trying to establish a mandatory license for foreign companies in this way. It is questionable whether this will actually work, but Huawei is taking forward-looking measures.

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